A low-cost suspension designed to meet the specification requirements for SiC/GaN substrate production polishing, optimized for batch and single crystal circular CMP systems. The advanced formula provides ultra-high polishing speed while maintaining high flatness, zero sub surface damage, and low defects and scratches.
Product Features:
■ Aluminum oxide suspension
■ Particle size: 250-350 nanometers
■ Solid content 5% by weight
■ PH: 8-10
■ Added KMnO4 oxidant
■ 20kg package
■ Suggest matching DuPont Suba 800 or Suba 800 M3
■ Quickly remove damaged layers and scratches
