Optimized suspension design for the polishing requirements of SiC/GaN wafer and substrate production.
Advanced formulas not only provide ultra-high polishing speed, but also maintain high flatness, zero sub surface damage, and low defects and scratches.
At the same time, the maximum consideration was given to energy conservation, emission reduction, and the impact on the environment during the production process.
We promise:
■ During the production process, there is no discharge of harmful substances and no environmental pollution.
■ The production process and products are both green and environmentally friendly, reducing the pressure on customers to use the environment.
■ Low carbon and low-energy manufacturing processes.
■ The raw and auxiliary materials have passed relevant testing and certification such as SGS and Rohs, and meet the requirements for use.
■ Using recycled materials such as packaging materials to minimize environmental burden as much as possible.
■ Green technology, environmental protection, biodegradability, and VOC compliance.
■ Improve EHS management functions to ensure compliance in environmental and safety management.
