A low-cost suspension designed to meet the specification requirements for SiC/GaN substrate production polishing, optimized for batch and single crystal circular CMP systems. Customers can add their own formula on site, which provides ultra-high polishing speed while maintaining high flatness, zero sub surface damage, and low defects and scratches.

Product Features:

■ Aluminum oxide suspension

■ Added KMnO4 oxidant

■ Solid content 5% by weight

■ Particle size: 200-300 nanometers

■ PH: 8-10

■ 20kg plastic drum packaging

■ Suggest matching multiple polishing pads such as DuPont Suba 800 or Suba 800 M3, IC1000, and Fujibo

■ Quickly remove damaged layers and scratches

X-ray Diffraction Pattern


Electron Microscopy Image