A low-cost suspension designed to meet the specification requirements for SiC/GaN substrate production polishing, optimized for batch and single crystal circular CMP systems. The advanced formula provides ultra-high polishing speed while maintaining high flatness, zero sub surface damage, and low defects and scratches.
Product Features:
■ Aluminum oxide suspension
■ Solid content 5% by weight
■ Particle size: 200-300 nanometers
■ Particle size: 200-300 nanometers
■ PH: 3-4
■ 20kg plastic drum packaging
■ Suggest matching multiple polishing pads such as DuPont Suba 800 or Suba 800 M3, IC1000, and Fujibo
■ Quickly remove damaged layers and scratches
