High purity cerium oxide polishing solution, specifically designed for surface polishing of glass materials such as silicon wafers, glass hard drives, optical glass, and glass wafers. Easy to disperse, high removal rate, long service life, and high surface quality.
Specifications:
■ Solid content: 30%
■ D50: 0.4-0.8 μ M
■ PH (30% in water): 8-12
■ Suspension treatment: Yes
■ Appearance: White slurry
Instructions for use:
■ Dilute with deionized water according to the required ratio, stir at 4000r/min for 10 minutes
■ Clean the polishing machine before adding fresh slurry
